Air bubbles pose a significant risk in sensor encapsulation, potentially compromising protection and reliability. Master Bond addressed this by implementing rigorous degassing protocols prior to ...

MATERIALS: Master Bond Inc’s Master Bond EP21FL is a two-part epoxy resin system that features low to moderate viscosity. It is well-suited for potting, coating and sealing electronic assemblies and ...

Epoxy resin is a versatile product in numerous industries thanks to its well-known strong adhesive properties. Due to its resistance to heat, moisture, and chemical exposure, it is the perfect ...

Epoxy resin formulations can be cured using a variety of curing agent (hardener) chemistries, each offering distinct advantages. Common options include amines, anhydrides, dicyandiamides, dihydrazides ...