A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

Silicon-based electronics are approaching their physical limitations and new materials are needed to keep up with current technological demands. Two-dimensional (2D) materials have a rich array of ...

Researchers led by Shengxi Huang at Rice University investigated the behavior of polarons, a type of quasiparticle, in the nanomaterial tellurene. They found that as tellurene’s thickness decreases to ...

The Global 2D Materials Market is projected to grow at a CAGR of 15.8% from 2026 to 2033, according to a new report published by Verified Market Reports®. The report reveals that the market was valued ...

The Nature Index 2025 Research Leaders — previously known as Annual Tables — reveal the leading institutions and countries/territories in the natural and health sciences, according to their output in ...