Singapore, Micron Technology
Key Takeaways Micron shares could remain in focus on Tuesday after leading a broad chip rally to start the week amid optimism that robust AI demand will continue to drive sector growth this year. The stock rallied from a key support area on the highest trading volume since mid-December,
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Operations are scheduled to start in 2026 with the expansion of packaging capacity beginning in 2027. Read more at straitstimes.com.
Since AI emerged as the world's next megatrend about two years ago, one product in particular has become the technology sector's holy grail.
Artificial intelligence technology has been a major driver of the bull market over the past couple of years. Technology firms, especially the
Micron Technology, Inc. (NASDAQ: MU) broke ground on a new HBM advanced packaging facility in Singapore, expanding its capacity and creating jobs.
Micron stock surges after Nvidia CEO praises their chips at CES. But mixed technical signals may impact the rally.
Micron is climbing today after Nvidia ( NVDA -4.83%) CEO Jensen Huang mentioned the company as a components supplier during his keynote speech at the kickoff of CES last night in Las Vegas. Huang said that Micron's chips would be included as part of his company's upcoming GeForce RTX 50 line of chips.
Talk about artificial intelligence and you immediately think about Nvidia (NASDAQ:NVDA), Broadcom (NASDAQ:AVGO), or even Palantir Technologies (NASDAQ:PLTR). But what if you have it all wrong? What if the future of AI is really Micron Technology (NYSE:MU)?
Shares of Micron Technology Inc. ( MU, Financial) surged 11% on Monday as investor sentiment in the highly cyclical semiconductor sector blossomed. That jump is fueled by a burst of momentum across the market, including in artificial intelligence (AI) technologies, a telling sign of a strong future for so many companies, including Micron.
Singapore can be expected to play a larger role in developing complex artificial intelligence (AI) applications when Micron's new $9.5 billion high-bandwidth module (HBM) advanced packing facility in Woodlands becomes operational in 2026.