NS Naontech engineers have been taking careful measurements of ambulance interiors and finding appropriate placements for the ...

Power Integrations has introduced a wide-creepage package option for its InnoSwitch3-AQ flyback switcher IC for automotive ...

Compound Semiconductor™ is an Angel Business Communications publication.

Under the agreement, the United States would support Bosch’s investment of $1.9 billion to modernise its SiC manufacturing ...

The US Department of Commerce has issued funding awards to GlobalWafers and its subsidiaries of up to $406 million under the ...

The Fraunhofer Institute for Applied Solid State Physics IAF is expanding its III-V capabilities as a contribution to the €730 million APECS ( Advanced Packaging and Heterogeneous Integration for ...