Edge AI, GenAI, and next-gen communications are adding more workloads to phones that are already under pressure to deliver ...

Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little ...

Smart glasses with augmented reality functions look more natural than VR goggles, but today they are heavily reliant on a ...

Loss Integration of High-Density Polymer Waveguides with Silicon Photonics for Co-Packaged Optics” was published by ...

Centric Analysis of DeepSeek’s Multi-Head Latent Attention” was published by researchers at KU Leuven. Abstract “Multi-Head Latent Attention (MLA), introduced in DeepSeek-V2, improves the efficiency ...

Software-defined products and custom silicon; finFET stress deformation; testing AI data center networks; European ...

How to put the pieces together in a complex design with AI is an unsolved problem.

Using horizontal integration with virtual electronic control units (vECUs), test automation, and continuous integration.

End-to-end solution that enhances EM analysis, improves co-design efficiency, and accelerates RF integration within ...

How inductive sensing (combined with capacitive sensing in some cases) enables a new level of smart surfaces with touch HMI.

A new technical paper titled “Modeling PFAS in Semiconductor Manufacturing to Quantify Trade-offs in Energy Efficiency and ...

The semiconductor industry is undergoing a fundamental shift from monolithic chip designs to chiplet-based architectures.