ASE will be represented at the Optical Fiber Conference 2025 in San Francisco this week by Dr. CP Hung, VP of R&D, who will deliver a presentation titled, 'Latest Advanced Packaging Solutions for AI', ...

SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI and ...

Recent reports indicate that China plans to introduce new chip performance standards regulations. Officially, the aim is to ...

L-R: Cadence’s Young; Synopsys’ Stahl; Siemens’ Munsey; ChipAgents’ Wang; Theodore Wilson. SE: What is a digital twin in the ...

Best Lab Characterization Services for Semiconductor Projects March 26, 2025 by David Edwards When embarking on a ...

MediaTek unveil silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.

Two leading LED companies, Osram and Nichia, have developed dedicated microLED solutions for car headlights, enabling more ...

Design engineers need ESD and TLP characterization data to make informed decisions to design robust circuits and systems.

SEALSQ filed its Condensed Consolidated Financial Statements in the Form 20-F for the full year period ended December 31, 2024, with the U.S. Securities and Exchange Commission on March 20, 2025. The ...

Easily and accurately measure dynamic characteristics on a Wide-Bandgap power semiconductor bare chip without soldering ... market-leading design, emulation, and test solutions to help engineers ...

“Most of the people using 3D-IC are vertically integrated,” says Ansys’ Swinnen. “They’re bigger companies that have the wherewithal to design the chips, design the interposer, simulate the whole ...

is considering an initial public offering in Malaysia as early as the second half of this year, people familiar with the matter said, riding on the country’s push to make its own chips.