This accomplishment can significantly improve data center efficiency and drive innovations in LiDAR, sensing, and quantum tech. Microcombs Shrink Lab-Grade Precision Onto a Chip The researchers ...
Abstract: The increasing power density of SiC power modules presents significant challenges in achieving uniform high-heat-flux thermal management, which is often limited by conventional packages. To ...
Abstract: This paper proposes a high-power-density 150 GHz phased-array transceiver designed for 6G user equipment (UE) modules, utilizing $65-\text{nm}$ CMOS technology. An 8 -element AiP module ...
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