Bartronics India Ltd and PTW Group from Singapore have signed an MoU to strengthen India’s semiconductor industry through a ...

The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology revealed a plan to invest $7 billion for a new high-bandwidth memory (HBM) packaging plant in Singapore.

Set to start operating in 2026, the plant will be used to package high-bandwidth memory chips, a type widely seen in AI data ...

Micron Technology (NASDAQ:MU) said on Wednesday that it broke ground on a new High-Bandwidth Memory, or HBM, advanced ...

Bartronics India, a leading Fin-tech business solution provider delivering cutting edge technology solutions to enterprises and PTW Group, a Singapore based semiconductor solutions provider have ...

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the ...

Micron invests $7 billion in Singapore's first high-bandwidth memory (HBM) facility to support growing AI demand.

Micron Technology (MU) is building a chip plant in Singapore, as part of an approximately $7 billion investment to meet ...

Micron (MU) broke ground on a new high-bandwidth memory advanced packaging facility adjacent to the company’s current facilities in Singapore.